The 2017 ASEE International Forum Steering Committee is seeking papers for the 6th Annual ASEE International Forum to be held in conjunction with the 2017 ASEE Annual Conference and Exposition on Wednesday, June 28, 2017, in Columbus, Ohio.
All accepted papers for a paper presentation will be indexed in the ASEE PEER repository at http://peer.asee.org/, in the Ei Compendex database on Engineering Village at http://www.engineeringvillage.com/, and in SCOPUS at http://www.scopus.com/home.url.
Members of the ASEE community and their global partners are invited to submit abstracts for papers to be presented at the 2017 ASEE International Forum highlighting initiatives, projects, research, trends, programs and partnerships. There is particular interest in engineering education activities involving at least two nations.
The abstracts and subsequent papers will be evaluated by reviewers selected by a Review Committee for quality and best-fit with the aim of planning well-balanced sessions. Papers not selected for a podium presentation may be eligible for a “technical posters” session. The program will include but not limited to two (2) sessions with three (3) parallel tracks each.
At this year’s International Forum there will be a special track on “advanced and digital manufacturing”. Please indicate your interest in submitting a paper on this topic to Ashok Agrawal (firstname.lastname@example.org).
Papers will be accepted for the following topics:
- Cross-cultural diversity
- Best practices in various approaches
- Student programs
- Engineering Education in Developing Nations
Additional topics in international engineering education will be considered.
|Important Dates and Deadlines
All deadlines are 4:59PM Eastern Time
|October 14, 2016||Abstract Submission Open|
|January 4, 2017||Registration Opens|
|January 22, 2017||Abstract Submission Closed|
|February 17, 2017||Abstract Decision|
|March 12, 2017||Paper Submissions Due|
|April 1, 2017||Paper Review Due|
|April 8, 2017||Notification of Authors|
|April 29, 2017||Final Papers Due|